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核工业西南物理研究院 ›› 2024, Vol. 44 ›› Issue (4): 394-400.DOI: 10.16568/j.0254-6086.202404004

• 核聚变工程 • 上一篇    下一篇

抛光和真空退火对钨表面微结构变化的影响研究

李 峰,刘 茗*,钱 伟,张归航,车 通,魏 然,谌继明,郑鹏飞   

  1. (核工业西南物理研究院,成都 610041)
  • 收稿日期:2022-07-24 修回日期:2024-08-01 出版日期:2024-12-15 发布日期:2024-12-10
  • 作者简介:李峰(1994−),男,山西大同人,研究实习员,从事聚变堆材料制备与性能研究。
  • 基金资助:
    国家重点研发计划(2017YFE0301306);四川省科技计划项目应用基础研究(2019YJ0301);西物创新项目(2020
    01XWCXRC014)

The influence of polishing and vacuum annealing on the microstructure of tungsten surface

LI Feng, LIU Ming, QIAN Wei, ZHANG Gui-hang,CHE Tong, WEI Ran, CHEN Ji-ming, ZHENG Peng-fei   

  1. (Southwestern Institute of Physics, Chengdu 610041)
  • Received:2022-07-24 Revised:2024-08-01 Online:2024-12-15 Published:2024-12-10

摘要: 针对钨表面微结构演变开展了一系列抛光和退火实验。借助扫描电子显微镜(SEM)以及电子背散射衍射(EBSD)等表征手段,研究了不同抛光工艺以及退火参数对表面形貌以及微结构的影响。结果表明,机械抛光后的钨在 800~1100℃范围内退火后,其表面会产生大量的具有小角度晶界的亚晶粒,而亚晶粒的尺寸和均匀性主要受到退火温度、时间以及表面变形程度的影响。研究发现,亚晶粒的平均晶粒尺寸会随着退火温度和时间的增加而增大,同时在温度高于 900℃时亚晶粒尺寸分布的均匀性降低;而在严重变形区域出现小晶粒的可能性更大。此外,当保温时间大幅增加时,即使退火温度低于再结晶温度也可以观察到样品表面会发生部分再结晶。

关键词: 钨, 抛光, 退火, 微结构, 亚晶粒

Abstract: The polishing and annealing experiments are carried out for their influence on tungsten surface microstructural changes. The different effects on surface morphology and microstructure were studied by scanning electron microscopy and electron backscatter diffraction. The experimental results demonstrate that tungsten surfaces polished by mechanical method would form numerous small subgrains with low angle grain boundary in the temperature range of 800~1100 ℃ , whose size and uniformity were mainly influenced by annealing temperatures and holding duration as well as the surface deformed degree. The study found that the average size of subgrains increases with elevating annealing temperature and duration, while the uniformity of size distribution decreases when the temperature is higher than 900℃. Small subgrains more likely appear in severe deformed areas.Furthermore, partial recrystallization occurs during prolonged annealing even at temperature well below the recrystallization temperature.

Key words: Tungsten, Polishing, Annealing, Microstructure, Subgrains

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