Effect of Ti coating on hot-isostatic pressing bonding of Be/CuCrZr

doi:10.16568/j.0254-6086.202501005

Abstract

Abstract:

Be and CuCrZr alloys are connected by the hot isostatic pressing bonding technique, and ultrasonic nondestructive testing (UT), SEM, EDS, XRD, hardness tester and material performance testing machine are used to analyze the interface bonding, microstructure, element distribution, phase composition, micro hardness and shearing strength. The results show that the effective connection of Be/CuCrZr alloys can be achieved at 580℃/150MPa/2h, and its shear strength is up to 110MPa, the joint exhibits a good bonding between Be and CuCrZr, and no visible cracks. The Ti transition layer on the surface of Be can effectively prevent the formation of brittle phases between the Be-Cu interface, the thickness of Ti diffusion layer in Cu is about 4μm, and the diffusion layer thickness in Be is about 2μm. Cu₄Ti、CuTi₃、Cu₄Ti₃、Be₁₀Ti、Be₁₂Ti、Be₁₇Ti₂ etc. various Cu-Ti, Be-Ti intermetallic compounds exist at the diffusion interface, and the shear fracture occurs at the Cu-Ti diffusion interface.

Key words: Hot isostatic pressing bonding, Be, CuCrZr alloys, Shearing strength

摘要：

采用热等静压扩散连接(HIPB)方法对Be和CuCrZr合金进行扩散连接，利用超声无损检测(UT)、SEM、EDS、XRD、硬度计及材料性能实验机对界面连接情况、微观组织形貌、元素分布、物相组成、显微硬度及剪切强度进行了分析表征。结果表明：在580℃/150MPa/2h条件下可实现Be/CuCrZr合金的有效连接，接头剪切强度达到110MPa，Be和CuCrZr界面结合良好且平整光滑，无连接裂纹；Be表面沉积的Ti过渡层能有效阻止Be-Cu界面脆性相的生成，Ti在Cu中的扩散层厚度约4μm，在Be中的扩散层厚度约2μm，扩散界面存在Cu4Ti、CuTi3、Cu4Ti3、Be10Ti、Be12Ti、Be17Ti2等多种Cu-Ti、Be-Ti金属间化合物，剪切断裂发生在Cu-Ti扩散界面上。

关键词: 热等静压扩散连接, Be, CuCrZr合金, 剪切强度

CLC Number:

TG146.2

WANG Hai-long, TANG Jiang-ke, ZHU Ying-xi, HU An-de. Effect of Ti coating on hot-isostatic pressing bonding of Be/CuCrZr[J]. Nuclear Fusion and Plasma Physics, 2025, 45(1): 27-33.

王海龙, 唐江科, 朱盈喜, 胡桉得. Ti涂层对Be/CuCrZr热等静压扩散连接的影响[J]. 核工业西南物理研究院, 2025, 45(1): 27-33.

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