第一壁材料W/Cu界面设计与制备研究现状

核聚变与等离子体物理 ›› 2014, Vol. 34 ›› Issue (4): 340-347.

第一壁材料W/Cu界面设计与制备研究现状

罗来马，谭晓月，罗广南，昝祥，朱晓勇，吴玉程

(1. 合肥工业大学材料科学与工程学院，合肥230009； 2. 安徽省有色金属材料与加工工程实验室，合肥230009； 3. 中国科学院等离子体物理研究所，合肥230031)

收稿日期:2013-06-03 修回日期:2014-01-27 出版日期:2014-12-15 发布日期:2014-12-15
作者简介:罗来马(1980-),男，江西省奉新县人，副教授，博士，硕士生导师，研究方向：有色金属与粉末冶金。
基金资助:
国家磁约束核聚变能发展研究专项(2014GB121001, 2010GB109004)；国家自然科学基金资助项目(51204064)

Current status of design and manufacture on W/Cu interface of the fist wall material

LUO Lai-ma, TAN Xiao-yue, LUO Guang-nan, ZAN Xiang,ZHU Xiao-yong, WU Yu-cheng

(1. College of Material Science and Engineering, Hefei University of Technology, Hefei 230009; 2. Laboratories of nonferrous metal material and processing engineering of Anhui province, Hefei 230009; 3. Institute of Plasma Physics, Chinese Academic Sciences, Hefei 230031)

Received:2013-06-03 Revised:2014-01-27 Online:2014-12-15 Published:2014-12-15

摘要/Abstract

摘要：

介绍了目前解决W/Cu连接界面缓解热应力的方法——添加适配层。在对不同适配层进行分析后，选出最佳W/Cu适配层，再对W/Cu适配层进行结构优化分析，得出选用W/Cu功能梯度材料作为适配层具有足够的结合强度，而且良好的导热性能能有效地缓解热应力。此外，重点阐述了目前成功的制备的W/Cu功能梯度材料用作W/Cu第一壁材料的适配层的常用方法。最后，对W/Cu功能梯度材料用作适配层解决W/Cu第一壁材料连接界面的问题做出了总结和展望。

关键词: 第一壁材料, 适配层, 界面特性, 钨铜梯度材料

Abstract:

This paper reviews the current method of solving the W/Cu interface connection and relieving the thermal stress by added adaptation layer. After analyzing the different adaptation layer, the best W/Cu adaptation layer is selected, and then the W/Cu layer structure optimization analysis is conducted. The results show that using W/Cu functionally graded materials as the combination of the adaptation layer has enough strength, and good thermal conductivity are more effective to alleviate thermal stress. In addition, this paper expounds the current method which utilizes the successfully prepared W/Cu functionally gradient materials as W/Cu adaptation layer used in the first wall materials. Finally, this paper has made the summary and prospect about that the functionally gradient materials of W/Cu used as the adaptation layer tosolve the first wall material W/Cu interface connection.

Key words: First wall materials, Adaptation layer, Interface characteristics, W-Cu gradient material

中图分类号:

TG146.1

罗来马，谭晓月，罗广南，昝祥，朱晓勇，吴玉程. 第一壁材料W/Cu界面设计与制备研究现状[J]. 核聚变与等离子体物理, 2014, 34(4): 340-347.

LUO Lai-ma, TAN Xiao-yue, LUO Guang-nan, ZAN Xiang,ZHU Xiao-yong, WU Yu-cheng. Current status of design and manufacture on W/Cu interface of the fist wall material[J]. NUCLEAR FUSION AND PLASMA PHYSICS, 2014, 34(4): 340-347.

参考文献

[1] Takeshi Hirai, Koichiro Ezato, Patrick Majerus. ITER relevant high heat flux testing on plasma facing surfaces[J]. Materials Transactions, 2005, 46 (3): 412.
[2] 许增裕. 聚变材料研究的现状和展望[J]. 原子能科学技术, 2003, 37(S1): 105.
[3] Mario Merola, Loesser D, Martin A, et al. ITER plasma facing components [J]. Fusion Engineering and Design, 2010, 85(10−12): 2312.
[4] Wang T G, Chen J L, Chen Y, et al. Thermal properties of VPS-W coatings on CuCrZr alloy with Ti bonding layer [J]. Journal of Nuclear Materials, 2007, 363:1294.
[5] Liu X, Yang L, Tamura S, et al. Thermal response of plasma sprayed tungsten coating to high heat flux [J]. Fusion Engineering and Design, 2004, 70: 341.
[6] You J H, Bolt H. Analyticalmethod for thermal stress analysis of plasma facing materials [J]. Journal of Nuclear Materials, 2001, 299: 9−19.
[7] Pei Zhao, Song Wang, Shibin Guo, et al. Bonding W and W-Cu composite with an amorphous W-Fe coated copper foil through hot pressing method [J]. Materials and Design, 2012, 42: 21.
[8] Fali Chong. Optimization of plasma-sprayed tungsten coating on copper with the heterogeneous compliant layer for fusion application [J]. Journal of Thermal Spray Technology, 2013, 22(1): 57.
[9] 种法力. 钨/铜第一壁复合材料界面行为研究[J]. 材料热处理技术, 2011, 40(2): 105.
[10] 凌云汉, 白新德, 葛昌纯, 等. W/Cu 功能梯度材料的热应力优化设计[J]. 稀有金属材料与工程, 2003, 32: 976.
[11] 刘彬彬, 谢建新. W/Cu 功能梯度材料的成分与结构设计[J]. 稀有金属, 2005, 29 (5): 757.
[12] 陶光勇, 郑子樵, 刘孙和. W/Cu 功能梯度材料板稳态热应力分析[J]. 中国有色金属学报, 2006, 16(4): 694.
[13] Bao-Lin Wang, Yiu-Wing Mai, Xing-Hong Zhang. Thermal shock resistance of functionally graded materials [J]. Acta Materialia, 2004, 52: 4961.
[14] 种法力, 陈俊凌, 李建刚. VPS-EBW法制备W/Cu功能梯度材料及热负荷实验研究[J]. 稀有金属材料与工程, 2006, 35 (9): 1509.
[15] Pintsuk G, Brünings S E, Döring J -E, et al. Development of W/Cu—functionally gradedmaterials [J]. Fusion Engineering and Design, 2003, 66−68: 237.
[16] 王鹏飞, 沈卫平, 张强, 等. 自蔓延预热爆炸固结Mo/Cu 功能梯度材料的研究[J]. 稀有金属材料与工程, 2007, 36 (4): 652.
[17] Kieback B, Neubrand A, Riedel H. Processing techniques for functionally graded materials [J]. Materials Science and Engineering, 2003, A362: 81.
[18] 周张建, 葛昌纯, 李江涛. 熔渗-焊接法制备W/Cu功能梯度材料的研究[J]. 金属学报, 2000, 36 (6): 655.
[19] 李明, 宋月青, 陆艳杰, 等. 熔铸-扩散法制备黄铜/钨铜功能梯度材料的研究[J]. 稀有金属, 2005, 29(5): 768.
[20] 汪峰涛, 吴玉程, 陈俊凌, 等. W-Cu 面度等离子体梯度热沉材料的制备和性能[J]. 复合材料学, 2008, 25(2): 25.
[21] 刘彬彬, 鲁岩娜, 谢建新. 热压烧结制备近全致密W-Cu梯度热沉材料[J]. 中国有色金属学报, 2007, 17(9): 1410.
[22] 刘彬彬, 谢建新, 陈江华. W-Cu 梯度功能材料的热物理性能[J]. 中国有色金属学报, 2009, 19(3): 538.
[23] 刘彬彬, 谢建新, 鲁岩娜. MBE 方法制备高致密W-Cu梯度功能材料的研究[J]. 稀有金属材料与工程, 2008, 37(7): 1269.
[24] Shi-Bo Li, Jian-Xin Xie. Processing and microstructure of functionally graded W/Cucomposites fabricated by multi-billet extrusion using mechanically alloyed powders [J]. Composites Science and Technology, 2006, 66(16): 2329.
[25] Zhou Z J, Kwon Y S. Fabrication of W-Cu composite by resistance sintering under ultra-high pressure [J]. Journal of Materials Processing Technology, 2005, 168: 107.
[26] 凌云汉, 周张建, 葛昌纯, 等. 超高压梯度烧结法制备W/Cu功能梯度材料[J]. 中国有色金属学报, 2001, 11(4): 576.
[27] Liu R, Hao T, Wang K, et al. Microwave sintering of W/Cu functionally graded materials [J]. Journal of Nuclear Materials, 2012, 431 (1−3): 196.
[28] 宋书香, 周张建, 葛昌纯,等. 不同界面对等离子喷涂钨结合强度的影响[J]. 稀有金属材料与工程, 2001, 36(10): 1811.
[29] 刘艳红, 张迎春, 葛昌纯. 金属钨涂层制备工艺的研究进展[J]. 粉末冶金材料科学与工程, 2011, 16(3): 315.
[30] Pintsuk G, Smid I, Döring J-E, et al. Fabrication and characterization of vacuumplasma sprayed W/Cu- composites for extreme thermal conditions [J]. Journal of Materials Science, 2007, 42(1): 30.