银铜钛膏状钎料钎焊石墨和铜合金接头的微观组织及性能

doi:10.16568/j.0254-6086.202002009

核聚变与等离子体物理 ›› 2020, Vol. 40 ›› Issue (2): 148-154.DOI: 10.16568/j.0254-6086.202002009

银铜钛膏状钎料钎焊石墨和铜合金接头的微观组织及性能

刘严伟1, 2，曹磊1，许铁军1，韩乐1，訾鹏飞1，姚达毛1

(1. 中国科学院等离子体物理研究所，合肥 230031；2. 中国科学技术大学，合肥 230026)

收稿日期:2019-01-08 修回日期:2019-10-15 出版日期:2020-06-15 发布日期:2020-06-15
作者简介:刘严伟(1990-)，男，河南正阳人，博士研究生，从事核聚变装置关键工艺技术研究。

Microstructure characteristics and property in joint of graphite/copper alloy brazed by Ag-Cu-Ti liquid solder

LIU Yan-wei1, 2, CAO Lei1, XU Tie-jun1, HAN Le1, ZI Peng-fei1, YAO Da-mao1

(1. Institute of Plasma Physics, Chinese Academy of Science, Hefei 230031; 2. University of Science and Technology of China, Hefei 230026)

Received:2019-01-08 Revised:2019-10-15 Online:2020-06-15 Published:2020-06-15

摘要/Abstract

摘要：

利用银铜钛(Ag-Cu-Ti)膏状钎料采用真空钎焊的方法对两种不同石墨和铜合金进行钎焊连接实验，研究了钎焊温度、中间缓冲层、母材尺寸等工艺参数对接头性能的影响。采用自行设计模具对接头的剪切强度进行了测试，利用扫描电镜和配带的X射线能谱分析仪分析了接头界面组织形貌及元素物相成分。研究结果表明：当钎焊温度为910℃，保温时间10min时，Ag-Cu-Ti膏状钎料能够与石墨和无氧铜两侧母材形成良好的结合界面；与GA石墨相比，阿泰克石墨与无氧铜接头强度更高；采用1mm无氧铜做中间缓冲层钎焊石墨和铬锆铜时，能有效缓解钎焊热应力，接头强度有明显提高。

关键词: 银铜钛(Ag-Cu-Ti)膏状钎料, 真空钎焊, 石墨, 铜合金, 剪切强度

Abstract:

Two kinds of graphite are brazed to copper alloy by Ag-Cu-Ti liquid solder via vacuum brazing technology. Experiments are conducted to investigate the influence of brazing temperature, intermediate layer and the size of bases on property of joints. Shear strength of joints are tested via self-designed mold by tensile testing machine. Microstructure characteristics and phase composition are observed and analyzed by scanning electron microscope and the build-in energy dispersive X-ray analysis. Experiment results reveal that continuous and tight joint interface organization of graphite/copper alloy is obtained in the condition of 910℃ brazing temperature holding for 10 minutes. Compared with GA graphite, joints of Artech graphite/copper alloy have higher shear strength. When oxygen-free copper of 1mm is used as the intermediate buffer layer, the brazing thermal stress can be effectively relieved and the joint strength can be significantly improved.

Key words: Ag-Cu-Ti paste solder, Vacuum brazing, Graphite, Copper alloy, Shear strength

中图分类号:

TL62+6

刘严伟1, 2，曹磊1，许铁军1，韩乐1，訾鹏飞1，姚达毛1. 银铜钛膏状钎料钎焊石墨和铜合金接头的微观组织及性能[J]. 核聚变与等离子体物理, 2020, 40(2): 148-154.

LIU Yan-wei1, 2, CAO Lei1, XU Tie-jun1, HAN Le1, ZI Peng-fei1, YAO Da-mao1. Microstructure characteristics and property in joint of graphite/copper alloy brazed by Ag-Cu-Ti liquid solder[J]. NUCLEAR FUSION AND PLASMA PHYSICS, 2020, 40(2): 148-154.

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银铜钛膏状钎料钎焊石墨和铜合金接头的微观组织及性能

Microstructure characteristics and property in joint of graphite/copper alloy brazed by Ag-Cu-Ti liquid solder

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